The construction of new fabs in the semiconductor industry is unparalleled. With 71 new fabs starting construction between 2022 and 2023, multiple companies are looking at how they can build upon traditional facility management techniques to unlock the true potential of Facility 2.0. How will we get there? And who will lead the way?
Alongside the growth of the sector comes the growth of those working within it. Facilities are navigating new technological and environmental landscapes, which can only be achieved with the right talent working in this fast-growing sector. Join our facilities’ executives as they talk about the operational challenges they currently face, their roles as leaders, and how they see their facilities growing in the future.
The UPM 2023 roundtable session is a platform to exchange ideas and insights and to engage with one another in a more conversational setting. Each roundtable moderator will lead 3 x 25-minute discussion groups.
Vincent Como, West Region Engineering Sponsor, Kiewit
Yinguo Cheng, Global OSM (Offsite Manufacturing) Manager, Intel
Vladimir Krupnik, Director, Business Development, Deaxo GmbH
Marc Henry, Project Execution Manager, Georg Fischer
TBC, LotusWorks
Brad Nelson, General Superintendent, Southwest Region., Hensel Phelps
Guy Bar-Ner, Construction and Facilities Supply Chain, Intel
Brian Jenkins, Senior Marketing Manager, Microelectronics, Nalco Water, An Ecolab Company
Rudy Labban, Bid Manager, Veolia Water Technologies & Solutions
Igor Novosselov, Research Associate Professor, University of Washington, Mechanical Engineering
Adam Stover, Chief Technology Officer/VP Applications and Technology, centrotherm clean solutions
John Rydzewski, Vice President and Private Sector Sustainability/Resilience Lead, Carollo Engineers
Anita Haupt, Director Process Design Water Treatment, DAS Environmental Expert
Marius Straub, Head of Proposal Management, H2O GmbH
Alana Denning, Process Engineer, Page Southerland Page
Denton Slovacek, Principal Application Development Manager – Power Industry, Hach
Brian Ross, Product Specialist, Horiba
Denise Haukkala, Technical Service and Development, DuPont Water Solutions
Siddarth Sampath, Applications Manager, Entegris
Lukas Weeden, Staff Engineer GCS, Samsung Austin Semiconductor
Presented by:
Geer Qile, Manager of Process Solutions, Saltworks
Co-Author(s):
Ben Sparrow, CEO, Saltworks
Pierce Maguire, Technology Specialist & Manager of Marketing, Saltworks
Presented by:
Myounghun Lee, Senior UPW Specialist, Future Water Resources Management Department, K-Water
Presented by:
Masahito Tochinai, Researcher, Kurita Water Industries
Co-Author(s):
Yasuharu Minato, Researcher, Kurita Water Industries
Midori Miyaji, Kurita Water Industries
Hideaki Iino, Team Lead Manager, Kurita Water Industries
Yoichi Miyazaki, Kurita Water Industries
Takeo Fukui, Kurita Water Industries
Presented by:
Gil Maron, Sr. Application Engineer, FTD Solutions
Co-Author(s):
Tomer Mori, CTO, Ashdod Refinery
Mark Kaganovsky, Site Water Engineer, Ashdod Refinery
Presented by:
Heather Reese, Senior Corporate Account Manager, Nalco Water, An Ecolab Company
Co-Author(s):
Brian Jenkins, Senior Marketing Manager, Microeletronics, Nalco Water, An Ecolab Company
Presented by:
Varun Vakharia, R&D Manager, Pall Corporation
Co-Author(s):
Sam Tang, Global Product Manager, Pall Corporation
Katsuhiko Tokuno, Pall Corporation
Presented by:
Siddarth Sampath, Applications Manager, Entegris
Co-Author(s):
Jamie Chung, Application Engineer, Entegris
Presented by:
Brianna Dufek, Chemist, Elemental Scientific
Co-Author(s):
Suhas Ketkar, Marketing Leader, Elemental Scientific
Austin Schultz, Engineer, Elemental Scientific
Presented by:
Tyler Goldstoff, Senior Engineer Facilities Engineering - UPW/WWT, GlobalFoundries
Co-Author(s):
Diwakar Paramasivam, Manager Facilities Engineering & Operations, GlobalFoundries
Zeph Egnasher, Facilities Engineer, GlobalFoundries
Presented by:
Brandon Ekberg, Principal, Farnsworth Group
Zeph Egnasher, Facilities Engineer, Ultrapure Water/WWT Process Support, GlobalFoundries
Presented by:
Yubeen Ji, Manager, K-Water
Presented by:
Satoru Ishihara, Chief Engineer, Nitto Denko Corporation, Japan
Co-Author(s):
Yasuhiro Tomi, Manager, Nitto Denko Corporation, Japan
David Shin, Application Development Manager, Hydranautics
Presented by:
Carla Frege, Application Scientist, Tofwerk
Co-Author(s):
Felipe Lopez, Tofwerk
Presented by:
Jens Herbig, Chief Technology Officer, IONICON Analytik
With 40+ technical presentations, 25+ roundtables, 6 panel discussions, and many more interactive workshops and networking sessions, there is a huge amount to unpack from the conference. How best to make sense of it all?
A group of the UPM co-moderators have you covered, distilling some key takeaways to recap the conference and share with your team.
Collaborate with 450+ experts from across the semiconductor supply chain and advance the semiconductor manufacturing and facility management solutions needed to unlock Facility 2.0 this October.