Construction in the semiconductor industry is undergoing a ‘perfect storm’ of issues. Total manufacturing construction spending has doubled in the US since the end of 2021, but productivity is hitting a record low. This panel will reveal why new approaches to construction are relevant to the entire value chain. 

This panel will answer three key questions: 

1. What is the right approach to offsite manufacturing, and how is critical for supporting the industry’s construction needs? 
2. Why does the semiconductor industry so urgently need a digital transformation? 
3. How can the supply chain react and collaborate to help ramp up semiconductor facilities faster and at a high quality? 

Presented by:

Yinguo Cheng, Process Engineer Group Leader, Intel

Sustainability is an industry priority. However, with the incorporation of sophisticated new semiconductor technology such as Gate-All-Around (GAA) transistors, the industry’s water, energy, chemical and gas footprint is set to increase rapidly. This panel will bring in multiple thought-leaders from across the industry to explain what is driving the sustainability effort and where the key capability gaps lie.  

This panel will answer three key questions: 

1. How will GAA and other semiconductor developments affect those working in the sustainability field? 
2. Where are facilities focusing their efforts in offsetting their footprints?
3. How do facilities manage trade-offs and difficult decisions relating to sustainability? 

Presented by:
Charlie Liu, National PFAS Lead, Kennedy Jenks Consultants

Presented by:
Allen Chan, R&D Scientist, Air Liquide

Co-Author(s):
Hugh Gotts, Senior Director of Research Development, Air Liquide

With new technologies demanding complex chip designs, yield is a key focus for endusers. Process steps are increasing exponentially, monitoring is becoming more challenging, and critical defect sizes are shrinking. Ultrapure water and chemicals are the last lines of defence before each process steps – contamination control has never been more important.  

This panel will answer three key questions:  

1. What is a wafer defect, and what causes it?   
2. How can we detect the source of contamination and deal with the root cause?   
3. How can we control contamination when metrology cannot keep up with the demands of new semiconductor technology?    

Moderated by:

• Ashutosh Bhabhe, Co-founder and CEO, 14si Solutions

Speakers:

• Jason Maas, Senior Director of Electrical, Gas and Chemical Facilities, Samsung Austin Semiconductor
• Hugh Gotts, Senior Director of Research and Development, Balazs NanoAnalysis

Presented by:
Jay Schumacher, Product Line Manager, Particle Measuring Systems

Presented by:
Najib Alia, Innovation Engineer, Ovivo

Co-Author(s):
Ian Briggs, Ovivo
Pranit Iyengar, Innovation Engineer, Ovivo
Pia Herrling, Head of Nanoparticle Group and Project Manager Innovation, Ovivo
Philippe Rychen, Global Director of Innovation, Ovivo

Presented by:
Brandon Ekberg, Principal, Farnsworth Group
Darin Amsberry, Director of Process Piping, Farnsworth Group

Presented by:

John Painter, Director, Business Development / Specialized Construction Solutions, GF Piping Systems
Daniel Williams, Senior Industry Consultant, Hexagon Engineering & Design Solutions

Presented by:
Andreas Neuber, SR Director for Eco Efficiency and Sustainability, Applied Materials

Presented by:
Emile McCormick, Project and Partnerships Manager, FTD Solutions

Co-Author(s):
Bonnie Marion, Technology Director - Water Systems, FTD Solutions

Noga Fridman-Bishop, R&D Lead, Sr. Project Engineer, FTD Solutions

Josh Best, VP of Innovation, FTD Solutions

Slava Libman, CEO, FTD Solutions

Presented by:
Rey Tanaka, Product Engineer, Screen SPE

Co-Author(s):
Paul Kerr, Strategic Facilities Engineer, Intel
Jim Snow, Senior Technologist, Screen SPE

Presented by:
Glen Sundstrom, UPW Techncial Director, Evoqua Water Technologies

Co-Author(s):
Stephen Witt, Facilities Engineer, Silfex, Inc.

Presented by:
Carles Crespo, Director of Corporate Industrial Water Practice, Isle Group Ltd.
Mattias Espanet, Facilities Process Program Manager, STMicroelectronics

Presented by:

Hiep Le, Chief Technology Officer, East Hemisphere, Gradiant International Holdings Pte Ltd

Co-Author(s):
Kurt Blohn, Process Engineer, Gradiant Corp. 

John Tracy, VP of Sales and Business Development, Gradiant Corp.

Presented by:
Larry Zazzera, Corporate Scientist, CT Associates, Inc

Co-Author(s):
Stefan Huber, DOC-LABOR
Gary Van Schooneveld, President, CT Associates
Bonnie Marion, Technology Director, FTD Solutions

Presented by:
Mark Litchy, Staff Engineer, CT Associates Inc.

Co-Author(s):
Derek Oberreit, Vice President, Kanomax FMT
Bonnie Marion, Technology Director, FTD Solutions
Gary Van Schooneveld, President, CT Associates Inc.
Larry Zazzera, Corporate Scientist, CT Associates Inc.

Presented by:
Ali Altun, CEO and Co-Founder, UNISERS

Presented by:
Lisa Klammsteiner, Innovation Engineer Nanotechnologies, Ovivo

Co-Author(s):
Pranit Iyengar, Innovation Engineer, Ovivo

Philippe Rychen, Global Director of Innovation, Ovivo

Pia Herrling, Head of Nanoparticle Group and Project Manager Innovation, Ovivo

Prof. Dr. Gisela Guthausen, Karlsruhe Institute of Technology, Germany

Presented by:

Mike Dixon, CEO - SmartOps, Gradiant

Co-Author(s):
Hiep Le, Chief Technology Officer, East Hemisphere, Gradiant International Holdings Pte Ltd

Jia Shin Ho, New Product Initiative (NPI) Scientist, Gradiant International Holdings Pte Ltd

Presented by:
Gil Maron, Sr. Application Engineer, FTD Solutions

Presented by:

Darragh Sweeney, Global Commissioning Program Manager, LotusWorks

Presented by:
Scott Corney, Technical Domain Leader - Microelectronics, Veolia Water Technologies & Solutions

Presented by:
Jochen Ruth, SLS Director, Pall GmbH

Co-Author(s):
Gerd Heser, Director of Product Planning and Management Water, Pall GmbH

Presented by:
Cameron Lippert, Chief Innovation Officer, ElectraMet

Co-Author(s):
James Landon, CTO, ElectraMet
Alan Rassoolkhani, Process Engineering Manager,  ElectraMet

Presented by:
Rudy Labban, Bid Manager, Veolia Water Technologies & Solutions

Presented by:
Ben Means, Manager, Project Development, Aquatech International

Co-Author(s):
Taylor Cowan, Marketing Communication Manager, Aquatech International
Josh Best, VP of Innovation, FTD Solutions
Ravi Chidambaran, President & Chief Technology Officer, Aquatech International
Boris Eliosov, Chief Technology Officer, FTD Solutions
Michael Lesniak, VP Net Zero Partnerships, Aquatech International

Presented by:
Seong Hoon Yoon, Corporate Scientist, Nalco Water

Presented by:
Robert McIntosh, Technical Market Manager, GF Piping Systems

Co-Author(s):
Casey Williamson, ME Market Development Manager, GF Piping Systems

Presented by:
Jochen Ruth, SLS Director Microelectronics Europe, Pall GmbH

Co-Author(s):
Gerd Heser, Application Manager UPW & Systems, Pall GmbH
Philippe Rychen, Global Director of Innovation, Ovivo

Presented by:
Ferdinando Crapulli, Research Scientist, Trojan Technologies

Co-Author(s):
Michael Sasges, Senior Research Engineer, Trojan Technologies